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HSMF-C114
Surface Mount Tricolor ChipLEDs
Data Sheet
Description The HSMF-C114 tricolor chip-type LED is designed in an ultra small package for miniaturiza-tion. It is the first of its kind to achieve such small packaging and be the thinnest package in the industry for tricolor package. With the freedom to have any combination of colors from mixing of the 3 primary colors, this will yield a wide variety of colors to suit every application and product theme. The small size, narrow footprint, and low profile make this LED excellent for back-lighting, status indication, and front panel illumination applications. In order to facilitate pick and place operation, this ChipLED is shipped in tape and reel, with 4000 units per reel. The package is compatible with reflow soldering and binned by both color and intensity.
Features * Common anode * Small 1.6 x 1.5 x 0.35 mm package * Diffused optics * Red/Green/Blue color combination * Available in 8 mm tape on 7" diameter reels * High brightness using AlInGaP and InGaN die technology * Compatible with reflow soldering Applications * Backlighting * Status indicator * Front panel indicator * Office automation, home appliances, industrial equipment
CAUTION: HSMF-C114 LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions
2 ANODE MARK
3 1.50 (0.059)
1
4
1.60 (0.063)
COMMON ANODE 1.10 (0.043) DIFFUSED EPOXY PC BOARD 0.12 (0.005) 0.35 (0.014) 1
2 RED
3 GREEN
4 BLUE
0.40 0.15 (0.016 0.006) ANODE MARK 0.50 (0.020) 0.40 (0.016)
NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
Absolute Maximum Ratings at TA = 25C Parameter AlInGaP Red InGaN Green InGaN Blue DC Forward Current[1,3] 20 20 20 Power Dissipation[1] 48 78 78 DC Forward Current[2] 15 15 15 Power Dissipation[2] 36 59 59 Reverse Voltage (IR = 100 A) 5 5 5 LED Junction Temperature 95 95 95 Operating Temperature Range -30 to 85 Storage Temperature Range -40 to 85 Soldering Temperature See reflow soldering profile (Figures 7 & 8)
Notes: 1. Applies when single LED is lit up. 2. Applies when all 3 LEDs are lit up simultaneously. 3. Derate linearly as shown in Figure 4. 4. Drive currents above 5 mA are recommended for best long term performance.
Units mA mW mA mW V C C C
2
Electrical Characteristics at TA = 25C Forward Voltage VF (Volts)[1] @ IF = 20 mA Typ. Max. 1.9 2.4 3.4 3.9 3.4 3.9 Reverse Breakdown VR (Volts) @ IR = 100 A Min. 5 5 5 Capacitance C (pF), @ VF = 0, f = 1 MHz Typ. 10 65 65
Part Number AlInGaP Red InGaN Green InGaN Blue
Note: 1. VF tolerance: 0.1 V.
Optical Characteristics at TA = 25C Luminous Intensity IV[1] (mcd) @ 20 mA Min. Typ. 28.5 150.0 45.0 180.0 28.5 70.0 Peak Wavelength lpeak (nm) Typical 637 523 468 Color, Dominant Wavelength ld[2] (nm) Typical 626 525 470 Viewing Angle 2q1/2[3] (Degrees) Typical 100 145 145 Luminous Efficacy hv (lm/W) Typical 155 477 75
Part Number AlInGaP Red InGaN Green InGaN Blue
Notes: 1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED package. 2. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. q1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
CAUTION: 1. The above optical performance specifications are valid in the case when single LED is lit up. 2. The above product specifications DO NOT
provide any guarantee on color mixing, color consistency over time, or uniformity in luminous intensity when more than 1 LED is lit.
3. Please refer to Avago Technologies' Application Brief AB D-007 for additional details/explanation on driving the part in parallel circuit.
3
Light Intensity (IV) Bin Limits[1] Intensity (mcd) Bin ID Minimum Maximum A 0.11 0.18 B 0.18 0.29 C 0.29 0.45 D 0.45 0.72 E 0.72 1.10 F 1.10 1.80 G 1.80 2.80 H 2.80 4.50 J 4.50 7.20 K 7.20 11.20 L 11.20 18.00 M 18.00 28.50 N 28.50 45.00 P 45.00 71.50 Q 71.50 112.50 R 112.50 180.00 S 180.00 285.00 T 285.00 450.00
Tolerance: 15% Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on current available bins.
AlInGaP Red Color Bin Limits[1] Dom. Wavelength (nm) Bin ID Minimum Maximum -- 620.0 635.0
Tolerance: 1 nm
InGaN Green Color Bin Limits[1] Dom. Wavelength (nm) Bin ID Minimum Maximum A 515.0 520.0 B 520.0 525.0 C 525.0 530.0 D 530.0 535.0
Tolerance: 1 nm
InGaN Blue Color Bin Limits[1] Dom. Wavelength (nm) Bin ID Minimum Maximum A 460.0 465.0 B 465.0 470.0 C 470.0 475.0 D 475.0 480.0
Tolerance: 1 nm Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on current available bins.
1.2
100 IF - FORWARD CURRENT - mA
1.2 1.0
1.0 RELATIVE INTENSITY
InGaN BLUE InGaN GREEN AlInGaP RED
0.8 0.6 0.4 0.2 0 400
10
AlInGaP RED
RELATIVE INTENSITY
0.8 0.6 InGaN GREEN & BLUE 0.4 AlInGaP RED 0.2
1
InGaN GREEN & BLUE
0.1
450 500 550 600 650 700 WAVELENGTH - nm
1.6
2.1
2.6
3.1
0
0
5
10
15
20
VF - FORWARD VOLTAGE - V
IF - FORWARD CURRENT - mA
Figure 1. Relative intensity vs. wavelength.
Figure 2. Forward current vs. forward voltage. Luminous intensity vs. forward current.
Figure 3. Luminous intensity vs. forward current.
4
IF MAX. - MAXIMUM FORWARD CURRENT - mA
25
1.2 1.0
20
RELATIVE INTENSITY
0 10 20 30 40 50 60 70 80 90
0.8 0.6 0.4 0.2 0 -90 -80 -70 -60 -50 -40 -30 -20 -10
15
10
5
0
0
10
20
30
40
50
60
70
80
90
TA - AMBIENT TEMPERATURE - C
ANGULAR DISPLACEMENT - DEGREES ()
Figure 4. Maximum forward current vs. ambient temperature.
Figure 5. Relative intensity vs. angle (AlInGaP RED).
1.2 1.0
RELATIVE INTENSITY
0.8 0.6 0.4 0.2 0 -90 -80 -70 -60 -50 -40 -30 -20 -10
0
10
20
30
40
50
60
70
80
90
ANGULAR DISPLACEMENT - DEGREES ()
Figure 6. Relative intensity vs. angle (InGaN GREEN and BLUE).
10 to 30 SEC.
TEMPERATURE
10 SEC. MAX.
TEMPERATURE
230C MAX. 140-160C 4C/SEC. MAX. OVER 2 MIN. TIME 4C/SEC. MAX. -3C/SEC. MAX.
217 C 200 C 150 C
255 - 260 C 3 C/SEC. MAX. 6 C/SEC. MAX. 3 C/SEC. MAX. 60 - 120 SEC. 100 SEC. MAX.
TIME
(Acc. to J-STD-020C)
Figure 7. Recommended reflow soldering profile.
Figure 8. Recommended Pb-free reflow soldering profile.
5
USER FEED DIRECTION
0.6
0.5
0.6
xxx xxxxx xxxxx xxxxx xxxxx xx
CATHODE SIDE
0.9
0.6
0.9
PRINTED LABEL
Figure 9. Recommended soldering land pattern.
Figure 10. Reeling orientation.
8.0 1.0 (0.315 0.039) O 13.1 0.5 (0.516 0.020) 10.50 1.0 (0.413 0.039)
3.0 0.5 (0.118 0.020)
O 20.20 MIN. (0.795 MIN.)
178.40 1 (7.024 0.039)
59.60 1.00 (2.346 0.039)
4.0 0.5 (0.157 0.020)
6 PS
5.0 0.5 (0.197 0.020)
NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
Figure 11. Reel dimensions.
6
4.00 (0.157) 1.50 (0.059)
DIM. C (SEE TABLE 1)
0.254 0.05 (0.010 0.002)
1.75 (0.069) 3.50 0.05 (0.138 0.002) DIM. A (SEE TABLE 1) 8.00 0.30 (0.315 0.012) CARRIER TAPE USER FEED DIRECTION
DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002) 4.00 (0.157)
COVER TAPE
TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMF-C114 DIM. A 0.10 ( 0.004) 1.75 (0.069) DIM. B 0.10 ( 0.004) 1.65 (0.065) DIM. C 0.10 ( 0.004) 0.55 (0.022)
Figure 12. Tape dimensions.
END
START
THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE.
MOUNTED WITH COMPONENTS.
THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE.
MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE.
Figure 13. Tape leader and trailer dimensions.
7
Convective IR Reflow Soldering For more information on reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30C @ 60% RH max. Baking is required before mounting if: 1. Humidity Indicator Card is > 10% when read at 23 5C. 2. Device exposed to factory conditions < 30C/60% RH more than 672 hours. Recommended baking condition: 60 5C for 20 hours.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2006 Avago Technologies Pte. All rights reserved. Obsoletes 5989-3351EN 5989-4809EN October 17, 2006

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